Changes to Step #8
Edit by CChin —
Edit approved by Kyle Smith
- Before
- After
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Step Lines
| [* black] More chips inside this silicon sandwich include: | |
| [* red] Qualcomm PM8150 power management IC | |
| [* orange] Qualcomm [link|https://www.qualcomm.com/products/wcd9341|WCD9341|new_window=true] audio codec | |
| - | [* yellow] |
| + | [* yellow] Samsung S2MIW04 power management |
| [* green] Samsung S2DOS04 DC-DC converter (likely for the backlight) | |
| [* light_blue] Qualcomm QDM3870 RF front-end module | |
| [* blue] Samsung S2MPB02 power management IC | |
| - | [* violet] Likely a Texas Instruments |
| + | [* violet] Likely a Texas Instruments [link|https://www.ti.com/product/TAS2562|TAS2562] audio amplifier |